COST_MP0602

COST MP0602

Advanced Solder Materials for High Temperature Application (HISOLD)

1st joint Working Group Meeting, Genova February 21-22, 2008

February 21, 2008

Plenary Lectures

D. Andersson, J. Pearce - High lead Replacement Soldrers - Patent and Literature Survey
M. Biglari - HT Solders, Case studies
P. Oberndorff - The Use of HT solders in Semiconductor Industry
J. Pearce - HT Solders - Expert Survey Results

Other lectures

R. Bergmann, P.T. Tang, H.N. Hansen, P. Moller - In Situ Investigation of Lead-free Solder Alloys Formation Using a Hot-plate Microscope
H. Flandorfer, C. Schmetterer, H. Ipser - The Intermetallic System Cu-Ni-Sn
K. Lilova, G. Vassilev et al - Studies of Bi-Cu based micro- and nanoparticles obtained by wet-chemical methods
A.A. Kodentsov - Some outstanding issues in reactivity of the Sn/Cu-Ni system
A. Popovic, L. Bencze - Determination of Mixing Thermodynamic Properties of Liquid Al-Cu-Sn System by Knudsen Effusion Mass Spectrometry
J. Vrestal - Reconciling of the Thermodynamic and Phase Equilibrium Data in the Ag-Pd System
J. Villain, U. Corradi, Ch. Weipert - Mechanical Properties and Microstructure of an Eutectic SnZn-Solder Alloy
A. Zemanova, A. Kroupa - The Experimental and Theoretical Study of the In-Ni-Sn system

February 22, 2008

S.G. Fries - Solders, Calphad and First-principles Linked by Crystallography
J. Medved, P. Mrvar - Testing the Possibility of Using HT Solder Materials Based on Pt for Application in Biomedicine
N. Moelans - WG 3: Processes at the Interface
J. Vrestal - Reconciling of the Thermodynamic and Phase Equilibrium Data in the Ag-Pd System
P. Sebo, D. Janickovic - Preliminary Results of Identification of Phases in SnAgCuIn-Cu Interface
I. Steinbach, M. Rettenmayr - Models of Non-equilibrium at Moving Interface
C. Schmetterer, J. Vizdal, A.A. Kodentsov, H. Ipser - The System Ni-P-Sn and Its Binary Constituents
P. Svasta, I. Plotog - Thermal Profile in Solder paste Reflow Process