Speakers: Chi-Chung Kei (National Research Laboratories, Tchaj-wan)
Place: místnost 117
Presented in English
Organisers:
Department of Functional Materials
The atomic layer deposition (ALD) is one of the thin film growth techniques. The ALD features an excellent thickness control. Furthermore, conformal coating on complex structures is achievable. The disadvantage of the ALD is a low deposition rate. Therefore, the ALD technique is mainly suitable for nanometric coatings. Currently, ALD is studied or used to improve the performance of Li based batteries, for coatings on Ag surfaces against tarnishing Ag, for coatings improving biocompatibility, as a gas diffusion barrier for polymers, for improving corrosion properties of steels, for ultrathin high-K dielectric films in semiconductor processing and etc.
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