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COST MP0602
Advanced Solder Materials for High Temperature Application (HISOLD)
Group projects

Borzone (University of Genova, Italy)
Dinsdale (NPL, Teddington, UK), MS Word document
Dinsdale (NPL, Teddington, UK), ppt presentation
Moelans (Katholieke Universiteit Leuven, Belgium), PPT presentation
Moelans (Katholieke Universiteit Leuven, Belgium), MS Word Document, UPDATED
Vassilev (University of Plovdiv, Bulgaria)
Sobczak Jerzy (Foundry Research Institute, Krakow, Poland)