COST_MP0602

COST MP0602

Advanced Solder Materials for High Temperature Application (HISOLD)

Expressions of interest

Bencze (E. Lorand Univ., Budapest, Hungary) & Popovic (JSI, Ljubljana, Slovenia)
Botsis & Cugnoni (EPFL, Lausanne, Switzerland)
Broz (MU Brno, The Czech Republic)
Drapala (TU Ostrava, The Czech Republic)
Fitzner (University of Sci. Technol., Krakow, Poland)
Fries (SGF, Aachen, Germany) & Steinbach (ACCESS e. V., Germany), now included in the GP lead by N. Moelans
Gasser (Metz, France), word document
Gasser (Metz, France), ppt document
Gurler (Eskisehir Osmangazi University, Eskisehir, Turkey)
Havia (Elektroniikan 3K - Tehdas, Finland)
Hoyer, Kaban (Chemnitz, UT, Germany)
Ipser (Universität Wien, Austria)
Janczak-Rush (EPMA, Switzerland)
Janickovic (Inst. of Physics, Bratislava, Slovakia)
Janovec & Ozvold (STU Bratislava, Slovakia)
Kroupa (IPM, Brno, The Czech Republic)
Leinenbach (EMPA Dübendorf, Switzerland), Klotz (FEM Schwäbisch-Gmünd, Germany)
Medved (Univ. of Ljubljana, Slovenia)
Mucklejohn (Ceravision Limited, UK)
Plevachuk (I.Franko University, Lviv, Ukraine)
Record (Université Aix-Marseille III, Marseille, France)
Sebo (IMM, Bratislava, Slovakia)
Sidorov (Ural State Pedagogical University, Ekaterinburg, Russia)
Sobczak Jerzy (Foundry Research Institute, Krakow, Poland), more detailed proposal is in the Groups Projects Section
Svasta (University of Bucharest, Romania)
Talijan (University of Belgrade, Belgrade, Serbia)
Tedenac, (University of Montpellier, France)
Villain 1 (University of Applied Sciences, Augsburg, Germany)
Villain 2 (University of Applied Sciences, Augsburg, Germany)
Zabdyr (IMIM Krakow, Poland)