cost-logo
logo-ipm
COST MP0602 - HISOLD
Advanced Solder Materials for High Temperature Application
Last update:
March 28, 2010 -
Updated:
- The update of the page was finaly realized, I apologize to all COST participants
- All documents from COST meetings are now stored at Contineo page. We transfer most of the traffic to this page as it is very good platform for the exchange of files and information. We will do our best to update this pages more frequently, nevertheless, the files and most of information will be now located at Contineo page.

Further information
If you do not have the address and access to the page, please, contact Chair of the Action - kroupa at ipm.cz

- The annual COST meeting was held in Bratislava, April 7-9 2010

Files update
- The documents from our COST meetings can be now found at Contineo webpage in following folders
- Budapest WG 1 meeting - Documents » Bibliography-Publications-Presentations » Presentations Budapest 2009
- Bochum Mid-term meeting - Documents » Bibliography-Publications-Presentations » Presentations BOCHUM 2009
- Genova WG 1 meeting - Documents » WG1 Meeting Genova Nov 2009
- Leuven WG 3 meeting
- Documents » Bibliography-Publications-Presentations » WG3meeting_Leuven_Jan2010
NEW
- Bratislava Annual Joint WG meeting - Documents » Bibliography-Publications-Presentations » Presentations Bratislava 2010
- SYSTEM TABLE to update the systems you are working on can be found in - Documents » System Table




image